Silicon Wafer Processing Services

NOVA has been providing reliable high quality wafer processing services since 1989. We continue to be a consistent and valuable resource for our clients' confidential custom processing needs. For information on additional services not listed below, please fill out our Services Request form.


FilmsThicknessDiameter
Dry Chlorinated Thermal Oxide with Anneal 100 - 5000Å 2" - 8"
Dry Thermal Oxide40 - 900Å2" - 8"
Thermal Oxide500 - 30,000Å2" - 12"
LPCVD Nitride Deposition200 - 3,000Å3" - 8"
Polysilicon Deposition1,000 - 20,000Å3" - 8"
Plasma Nitride Deposition1,000 - 10,000Å3" - 8"
Plasma Oxide Deposition1,000 - 10,000Å3" - 8"
PETEOS Oxide Deposition500 - 30,000Å8" only

Metal Deposition Thickness Diameter
Al50 - 20,000Å1" - 8"
Al Alloys50 - 20,000Å1" - 8"
Ag50 - 5,000Å3" - 8"
Au50 - 5,000Å3" - 8"
Co50 - 3,000Å1" - 6"
Cr50 - 5,000Å1" - 8"
Cu50 - 15,000Å
max 3,000Å on 12"		1" - 8"
Ir200Å - 3,000Å4" - 8"
Mo50 - 3,000Å1" - 12"
Pd50 - 5,000Å3" - 8"
Pt50 - 5,000Å3" - 8"
Rh200 - 3,000Å4" - 8"
Ta50 - 5,000Å1" - 12"
TaN50 - 3,000Å1" - 12"
Ti50 - 5,000Å1" - 12"
TiN50 - 3,000Å1" - 12"
W50 - 8,000Å
max 3,000Å on 12"		1" - 8"
TiW200 - 3,000Å2" - 12"

If you are interested in any of the above processing services or one not listed, please fill out our Services Request form.


Wafer Processing

  • Backgrinding
  • Dicing
  • Edge Rounding
  • Epi
  • Laser Cut Down
  • Laser Marking
  • Micro Machining
  • Photoresist Coating - 5,000 - 30,000Å
  • Photoresist Stripping - H2SO4 / H202 (Piranha), Plasma
  • Plasma Stripping / Etching - Poly / Nitride
  • Polishing - single side or double side
  • Proximity Photolithography
  • Sandblasting
  • Slicing
  • Stepped Photolithography
  • Thinning
  • Wet Cleaning - RCA, SC1 - SC2, Dilute HF/DI cleaning
  • Wet Pattern Etching - HF-BOE oxide, KOH Silicon etching

If you are interested in any of the above processing services or one not listed, please fill out our Services Request form.

Wafer Reclaim / Recycling

Wafer recycling is a combination of wet chemical and dry etching to remove most deposited semiconductor thin films. To remove scratches, scribe marks, silicon haze or other related defects, polishing will be done.

Many companies have taken advantage of our recycling service. We have successfully processed and recovered for re-use prime and test wafers of all sizes including 300mm.

For more information please fill out our Services Request form.


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NOVA offers the best competitive pricing without sacrificing quality. No order is too big or too small for us to handle. Contact Us today.