Silicon Wafer Processing Services
NOVA has been providing reliable high quality wafer processing services since 1989. We
continue to be a consistent and valuable resource for our clients' confidential custom
processing needs. For information on additional services not listed below, please
fill out our Services Request form.
If you are interested in any of the above processing services or one not listed, please fill out our Services Request form.
- Backgrinding
- Dicing
- Edge Rounding
- Epi
- Laser Cut Down
- Laser Marking
- Micro Machining
- Photoresist Coating - 5,000 - 30,000Å
- Photoresist Stripping - H2SO4 / H202 (Piranha), Plasma
- Plasma Stripping / Etching - Poly / Nitride
- Polishing - single side or double side
- Proximity Photolithography
- Sandblasting
- Slicing
- Stepped Photolithography
- Thinning
- Wet Cleaning - RCA, SC1 - SC2, Dilute HF/DI cleaning
- Wet Pattern Etching - HF-BOE oxide, KOH Silicon etching
If you are interested in any of the above processing services or one not listed, please fill out our Services Request form.
Wafer Reclaim / Recycling
Wafer recycling is a combination of wet chemical and dry etching to remove most
deposited semiconductor thin films. To remove scratches, scribe marks, silicon haze
or other related defects, polishing will be done.
Many companies have taken advantage of our recycling service. We have successfully
processed and recovered for re-use prime and test wafers of all sizes including 300mm.
For more information please fill out our Services Request form.
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NOVA offers the best competitive pricing without sacrificing quality. No order is too big or too small for us to handle. Contact Us today.
